Little Known Facts About Noohapou.
The POU3500 system gives dynamic temperature control of the procedure chamber cathode / electrode / anode and may be synchronized with any etch process.
Resource & TCU software package calibration treatments vary exterior exam machines not made use of routinely for verifying
the data under is classified by semiconductor system and Resource company. Each individual table contains an apps Matrix that displays qulified and professional procedures.
Originally founded in 1985, our corporation has grown into a identified chief in furnishing temperature control systems to the global semiconductor field.
This impressive program, featuring a small form issue, cheap-of-possession and Dynamic Temperature Control made available process and gear engineers a whole new Device to optimize their temperature delicate processes.
The precision with the POU 3300 permits impartial Charge of the procedure fluid temperature into the wafer chuck in +/- 0.1 °C of established stage, along with the rapidly reaction time of the program lets for maximum wafer-to-wafer repeatability through the etch approach.
All static TCUs involve surplus cooling & heating capacities because of their very massive system fluid reservoirs. the method fuid reservoir on LAUDA-Noah's dynamic temperature Management system is fewer than one gallon.
With all the POU3300, it is possible to obtain unparalleled results in etch functionality, chamber uptime, decreased price of possession and fab space utilization – all though enhancing your method reliability.
significant Footprint: Static units occupy considerable space within the fabrication tool area, lowering its efficiency.
Dynamic Temperature Manage, as applied in programs just like the LAUDA-Noah POU, is definitely an approach that senses the temperature of the method fluid coming back from the process chamber’s wafer chuck (ESC) and dynamically adjusts the temperature of the provided process fluid according to this authentic-time comments.
The TEs' can swap directly from heating to cooling, or visa-versa. they will switch on & off whilst from the heating or cooling method and may boost or minimize the amount of heating or cooling with no switching in any way.
The POU3300 technique offers dynamic temperature Charge of the process chamber cathode / electrode / anode and will be synchronized with any etch method.
verified; TEs' signify only one part of a chiller's design and style. The switching & Handle strategies employed by a chiller will effects the TEs' dependability.
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We call for a lot here less cooling/heating potential for a similar application to be a static TCU due to our compact reservoir quantity.